Technical Data

  • Max. Panel Size up to 1500mm x 670mm
  • Circuit Board Thickness 0,1-17,5mm
  • Smallest Drill Hole 0,075mm
  • Smallest Line/Space 50µm
  • Copper up to 1000µm
  • Up to 58 layers
  • Aspect Ratio 20:1
  • Starrflex und Flex
  • Viaplugging
  • Impedance Control
  • Laser-Microvias
  • Blind-, Buried Vias

Base Material

  • FR4, FR4 High TG, FR4 halogen free, CEM1/3, Rogers, Ceramic (Al2O3), Polyimid and others

Surface

  • HAL leadfree, HAL Pb/Sn (leaded), imm. Ni/Au (ENIG), imm. Ni/Pd/Au (ENEPIG), imm. Sn, imm. Ag, OSP (Entek), galv. Ni/Au, Carbon, Ag/Pt (Thick film technology) and others

Soldermask and Overlay

  • Different coating systems (halogen free) and colors

Standards

  • ISO 9001:2008 / TS 16949
  • UL-Listung
  • RoHS / REACH
  • According to IPC A600 class 2 and 3

Delivery time

  • Speedservice starting from 1 wd
  • Seriesproduction starting from 10 wds